Product Description

Designed for use in flexible circuit manufacturing, electronic component masking, MLCC (Multilayer Ceramic Capacitor) production, LED potting processes, and splicing of release liners or papers. This tape offers excellent temperature resistance (up to 200 °C for 30 minutes), strong adhesion, and superior solvent resistance with zero penetration. Ideal for use during soldering and casting processes, it provides reliable protection without leaving adhesive residue upon removal.